Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9686866 | Package structure and manufacturing method thereof | Hung-Lin Chang | 2017-06-20 |
| 9433108 | Method of fabricating a circuit board structure having an embedded electronic element | Yung-Ching Lin, Chih-Kuie Yang | 2016-08-30 |