Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7361057 | Method and apparatus for soldering option of a highly integrated miniaturized form factor card | Shanquan Bao, Hongqi Wu | 2008-04-22 |
| 7333339 | Heat dissipation system for a miniaturized form factor communications card | Guo Liu, Shanquan Bao, William Xiao-Qing Huang, Meng-en Tan | 2008-02-19 |