Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643020 | System and method to estimate a number of layers needed for routing a multi-die package | Taranjit Singh Kukal, Jitin Jacob, Navkamal Rakra | 2020-05-05 |
| 9454634 | Methods, systems, and computer program product for an integrated circuit package design estimator | Taranjit Singh Kukal, Avinash Singh | 2016-09-27 |