Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446471 | Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package | Jaehong Park, Hanhong Lee, Woon-young Baek | 2019-10-15 |
| 10177072 | Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package | Jaehong Park, Hanhong Lee, Woon-young Baek | 2019-01-08 |