SC

Suchet P. Chai

TI Teledyne Industries: 2 patents #26 of 87Top 30%
📍 San Jose, CA: #17,604 of 32,062 inventorsTop 55%
🗺 California: #185,134 of 386,348 inventorsTop 50%
Overall (All Time): #2,196,822 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6828663 Method of packaging a device with a lead frame, and an apparatus formed therefrom Tong-Yu Chen 2004-12-07
6507110 Microwave device and method for making same Tong-Yu Chen 2003-01-14