SC

Siu Chiu

AA Asm Assembly Automation: 1 patents #73 of 182Top 45%
HU Hong Kong Polytechnic University: 1 patents #243 of 733Top 35%
Overall (All Time): #3,592,090 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6279810 Piezoelectric sensor for measuring bonding parameters Lai Wa Helen Chan-Wong, Siu Wing Or, Yiu Ming Cheung 2001-08-28