Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10600766 | Dual-channel heat-conducting encapsulation structure and encapsulation method of a solid-state phosphor integrated light source | Jieqin Zhang, Maochun HONG, Wenxiong Lin, Wang Guo, Yunfeng Zhang | 2020-03-24 |
| 10504875 | Die-bonding substrate, high-density integrated COB white light source and method for manufacturing the same | Jieqin Zhang, Maochun HONG, Wenxiong Lin, Wang Guo, Yunfeng Zhang | 2019-12-10 |