Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6394175 | Top mounted cooling device using heat pipes | Roger J. Hooey | 2002-05-28 |
| 6386844 | Miniature liquid transfer pump and method of manufacturing same | Roger J. Hooey | 2002-05-14 |
| 6377466 | Header, a method of manufacture thereof and an electronic device employing the same | Roger J. Hooey | 2002-04-23 |
| 6320762 | Fixed conductive pin for printed wiring substrate electronics case and method of manufacture therefor | Roger J. Hooey | 2001-11-20 |
| 6317324 | Encapsulated power supply with a high thermal conductivity molded insert | Roger J. Hooey | 2001-11-13 |
| 6301120 | Circuit board apparatus | Roger J. Hooey, Thang D. Truong | 2001-10-09 |
| 6263957 | Integrated active cooling device for board mounted electric components | Roger J. Hooey, Robert E. Radke | 2001-07-24 |
| 6206708 | Through via plate electrical connector and method of manufacture thereof | Roger J. Hooey, Robert E. Radke | 2001-03-27 |
| 6181577 | Auxiliary bias circuit for a power supply and a method of operation thereof | Feng Lin | 2001-01-30 |
| 6165596 | Multi-layer insulated metal substrate printed wiring board having improved thermal coupling of components | Robert E. Radke | 2000-12-26 |
| 6144557 | Self-locking conductive pin for printed wiring substrate electronics case | Roger J. Hooey | 2000-11-07 |
| 6083772 | Method of mounting a power semiconductor die on a substrate | Wayne C. Bowman | 2000-07-04 |
| 6061260 | Board mounted power supply having an auxiliary output | Feng-Wei Lin | 2000-05-09 |
| 6034441 | Overcast semiconductor package | — | 2000-03-07 |
| 5872403 | Package for a power semiconductor die and power supply employing the same | Wayne C. Bowman | 1999-02-16 |
| 5804952 | Encapsulated package for a power magnetic device and method of manufacture therefor | — | 1998-09-08 |
| 5659462 | Encapsulated, integrated power magnetic device and method of manufacture therefor | Ashraf W. Lotfi, Robert Joseph Roessler, John D. Weld | 1997-08-19 |