Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11573143 | Mems pressure sensing element with stress adjustors to minimize thermal hysteresis induced by electrical field | Jen-Huang Albert Chiou | 2023-02-07 |
| 11029227 | CSOI MEMS pressure sensing element with stress equalizers | Jen-Huang Albert Chiou | 2021-06-08 |
| 10221062 | Cavity with silicon on insulator MEMS pressure sensing device with an extended shallow cross-shaped cavity | Jen-Huang Albert Chiou | 2019-03-05 |
| 10060820 | Stress-isolated absolute pressure sensor | Jen-Huang Albert Chiou, Robert C. Kosberg, Daniel Roy Empen | 2018-08-28 |
| 9964458 | Pressure sensor device with anchors for die shrinkage and high sensitivity | Jen-Huang Albert Chiou | 2018-05-08 |
| 9846095 | 3D stacked piezoresistive pressure sensor | Jen-Huang Albert Chiou, Robert C. Kosberg | 2017-12-19 |
| 9846096 | Symmetrical piezoresistive pressure sensor with stacking ICs | Robert C. Kosberg, Jen-Huang Albert Chiou | 2017-12-19 |
| 9764947 | Piezoresistive pressure sensor device | Jen-Huang Albert Chiou | 2017-09-19 |
| 9651441 | Pressure sensor device with high sensitivity and high accuracy | Jen-Huang Albert Chiou | 2017-05-16 |
| 9395259 | Piezoresistive transducer with low thermal noise | Jen-Huang Albert Chiou, Xiaoyi Ding, Jeffrey J. Frye | 2016-07-19 |
| 8881596 | Semiconductor sensing device to minimize thermal noise | Jen-Huang Albert Chiou | 2014-11-11 |
| 8302483 | Robust design of high pressure sensor device | Jen-Huang Albert Chiou | 2012-11-06 |
| 8191423 | Grooved structure for die-mount and media sealing | Jen-Huang Albert Chiou | 2012-06-05 |
| 7997142 | Low pressure sensor device with high accuracy and high sensitivity | Jen-Huang Albert Chiou | 2011-08-16 |
| 7180019 | Capacitive accelerometer or acceleration switch | Jen-Huang Albert Chiou, Arthur J. Edwards | 2007-02-20 |
| 7009124 | Acceleration switch | Jen-Huang Albert Chiou, Carl Ross | 2006-03-07 |
| 6881648 | Semiconductor wafer having a thin die and tethers and methods of making the same | Raymond Garza, Carl Ross, Stefan Turalski | 2005-04-19 |
| 6772509 | Method of separating and handling a thin semiconductor die on a wafer | Cheryl Field, Didier Lefebvre, Joe Wang | 2004-08-10 |
| 6608370 | Semiconductor wafer having a thin die and tethers and methods of making the same | Raymond Garza, Carl Ross, Stefan Turalski | 2003-08-19 |
| 6427539 | Strain gauge | Yanling Kang, Sut-Mui Tang, Joe Wang | 2002-08-06 |
| 5744725 | Capacitive pressure sensor and method of fabricating same | Carl Ross, Donald L. Hughes | 1998-04-28 |
| 5600072 | Capacitive pressure sensor and method for making the same | Carl Ross | 1997-02-04 |
| 5365790 | Device with bonded conductive and insulating substrates and method therefore | Carl Ross, Roseann M. Tomasello, Anita G. Brandes | 1994-11-22 |
| 5173836 | Hermetically sealed interface | Joseph P. Tomase, Gregory Stamm, Marc Chason | 1992-12-22 |