Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12029049 | Memory structures and methods for forming the same | Po-Yen Hsu, Bo-Lun Wu, Tse-Mian Kuo, Wei-Che Chang | 2024-07-02 |
| 10685883 | Method of wafer dicing and die | Cheng-Hong Wei, Hung-Sheng Chen, Ching-Wei Chen | 2020-06-16 |
| 10636967 | Method for manufacturing electrode and resistive random access memory | Yi-Chung Chen, Cheng-An Peng, Sung-Ying Wen | 2020-04-28 |
| 10515853 | Method of wafer dicing | Ching-Wei Chen, Cheng-Hong Wei, Hung-Sheng Chen, Hsin-Hung Chou | 2019-12-24 |
| 10305033 | Resistive random access memory | — | 2019-05-28 |
| 9691979 | Resistive random access memory and method of fabricating the same | Chia-Hua Ho | 2017-06-27 |
| 9356235 | Structure and formation method of memory device | Po-Yen Hsu, Hsiu-Han Liao, Chia-Hua Ho | 2016-05-31 |
| 9224947 | Resistive RAM and method of manufacturing the same | Sung-Ying Wen | 2015-12-29 |
| 9166160 | Resistive random access memory and method of fabricating the same | Chia-Hua Ho, Hsiu-Han Liao, Po-Yen Hsu, Meng-Hung Lin, Bo-Lun Wu +1 more | 2015-10-20 |
| 8043884 | Methods of seamless gap filling | Shin-Yu Nieh, Hui-Lan Chang, Cheng Chen | 2011-10-25 |