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Hermetic feedthrough terminal assembly with wire bond pads for human implant applications |
Robert A. Stevenson, Richard L. Brendel, Christine A. Frysz, Haytham Hussein, Ryan A. Stevenson |
2009-11-24 |
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EMI filter terminal assembly with wire bond pads for human implant applications |
Robert A. Stevenson, Richard L. Brendel, Christine A. Frysz, Haytham Hussein, Ryan A. Stevenson |
2007-12-18 |
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Method for minimizing stress in feedthrough capacitor filter assemblies |
Robert Naugler, Haytham Hussein, Thomas W. Shipman, Richard L. Brendel, Christine A. Frysz |
2006-12-05 |
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EMI filter terminal assembly with wire bond pads for human implant applications |
Robert A. Stevenson, Richard L. Brendel, Christine A. Frysz, Haytham Hussein, Ryan A. Stevenson |
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Feedthrough terminal assembly with lead wire bonding pad for human implant applications |
Robert A. Stevenson, Richard L. Brendel, Christine A. Frysz, Haytham Hussein |
2006-03-14 |