Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8809180 | Producing SiC packs on a wafer plane | Karl Weidner | 2014-08-19 |
| 8415802 | Strip conductor structure for minimizing thermomechanical loads | Michael Kaspar, Karl Weidner, Hans Wulkesch | 2013-04-09 |
| 8395257 | Electronic module and method for producing an electric functional layer on a substrate by blowing powder particles of an electrically conductive material | Jens-Christian Holst, Jens Dahl Jensen, Karl Weidner | 2013-03-12 |
| 8261439 | Method for contacting electronic components by means of a substrate plate | Axel Kaltenbacher, Michael Kaspar, Gernot Schimetta, Karl Weidner, Jörg Zapf | 2012-09-11 |
| 7821184 | Contacting multilayer piezo actuators or sensors | Michael Kaspar, Erhard Magori | 2010-10-26 |
| 4195826 | Arrangement for a low-noise and low-shock interception of moving masses | Georg Wiesmeier | 1980-04-01 |