| 9732780 |
Cantilever assembly |
Randy Anderson, Edward Aguilar |
2017-08-15 |
| 6163463 |
Integrated circuit chip to substrate interconnection |
— |
2000-12-19 |
| 5795818 |
Integrated circuit chip to substrate interconnection and method |
— |
1998-08-18 |
| 5722161 |
Method of making a packaged semiconductor die including heat sink with locking feature |
— |
1998-03-03 |
| 5701034 |
Packaged semiconductor die including heat sink with locking feature |
— |
1997-12-23 |
| 5583378 |
Ball grid array integrated circuit package with thermal conductor |
Ronald J. Molnar |
1996-12-10 |
| 5485037 |
Semiconductor device having a thermal dissipator and electromagnetic shielding |
— |
1996-01-16 |
| 5483100 |
Integrated circuit package with via interconnections formed in a substrate |
Tadashi Hirakawa |
1996-01-09 |
| 5482898 |
Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding |
— |
1996-01-09 |
| 5478007 |
Method for interconnection of integrated circuit chip and substrate |
— |
1995-12-26 |
| 5455462 |
Plastic molded package with heat sink for integrated circuit devices |
— |
1995-10-03 |
| 5378869 |
Method for forming an integrated circuit package with via interconnection |
Tadashi Hirakawa |
1995-01-03 |
| 5355283 |
Ball grid array with via interconnection |
Tadashi Hirakawa |
1994-10-11 |
| 5328870 |
Method for forming plastic molded package with heat sink for integrated circuit devices |
— |
1994-07-12 |