Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5874321 | Package integrated circuit having thermal enhancement and reduced footprint size | Thomas H. Templeton, Jr. | 1999-02-23 |
| 5766975 | Packaged integrated circuit having thermal enhancement and reduced footprint size | Thomas H. Templeton, Jr. | 1998-06-16 |
| 5448165 | Electrically tested and burned-in semiconductor die and method for producing same | Thomas H. Templeton, Jr. | 1995-09-05 |
| 4420767 | Thermally balanced leadless microelectronic circuit chip carrier | Mark A. Brodsky | 1983-12-13 |