Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5122475 | Method of making a high speed, high density semiconductor memory package with chip level repairability | Douglas E. Heckaman | 1992-06-16 |
| 5014114 | High speed, high density semiconductor memory package with chip level repairability | Douglas E. Heckaman | 1991-05-07 |
| 4947111 | Test fixture for multi-GHZ microwave integrated circuits | Gilbert R. Perkins | 1990-08-07 |
| 4890195 | Replaceable MMIC chip carrier captured by differential thermal expansion between carrier and support housing | Douglas E. Heckaman, Gilbert R. Perkins | 1989-12-26 |
| 4851793 | Waffleline - configured transmission link | Douglas E. Heckaman, Jeffrey A. Frisco, Edward J. Bajgrowicz | 1989-07-25 |
| 4695810 | Waffleline-configured microwave transmission link | Douglas E. Heckaman, Jeffrey A. Frisco, Edward J. Bajgrowicz | 1987-09-22 |
| 4641140 | Miniaturized microwave transmission link | Douglas E. Heckaman, Jeffrey A. Frisco | 1987-02-03 |