Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5516030 | Method and apparatus for assembling ball grid array components on printed circuit boards by reflowing before placement | — | 1996-05-14 |
| 5511306 | Masking of circuit board vias to reduce heat-induced board and chip carrier package warp during wavesolder process | George H. Bumgardner, Timothy M. McGuiggan, Andrew Jefferson Mawer | 1996-04-30 |