Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9913403 | Flexible coolant manifold—heat sink assembly | Francis R. Krug, Jr., Eric J. McKeever, Robert K. Mullady, Donald W. Porter, John G. Torok +2 more | 2018-03-06 |
| 9648786 | Interlock assembly for air-moving assembly | Levi A. Campbell, Christopher R. Ciraulo, Milnes P. David, Dustin W. Demetriou, John J. Loparco +4 more | 2017-05-09 |
| 9629284 | Interlock assembly for air-moving assembly | Levi A. Campbell, Christopher R. Ciraulo, Milnes P. David, Dustin W. Demetriou, John J. Loparco +4 more | 2017-04-18 |
| 9504184 | Flexible coolant manifold-heat sink assembly | Francis R. Krug, Jr., Eric J. McKeever, Robert K. Mullady, Donald W. Porter, John G. Torok +2 more | 2016-11-22 |
| 9497888 | Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s) | Amilcar R. Arvelo, Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever | 2016-11-15 |
| 9298231 | Methods of fabricating a coolant-cooled electronic assembly | Amilcar R. Arvelo, Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever | 2016-03-29 |
| 9265178 | Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s) | Amilcar R. Arvelo, Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever | 2016-02-16 |
| 9253923 | Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s) | Amilcar R. Arvelo, Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever | 2016-02-02 |