Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538726 | Method for forming packaged semiconductor die with micro-cavity | Matthias Klein, Andreas Zakrzewski | 2022-12-27 |
| 11244876 | Packaged semiconductor die with micro-cavity | Matthias Klein, Andreas Zakrzewski | 2022-02-08 |
| 9023442 | Metallization for a cavity housing and a nonmagnetic sealed cavity housing | — | 2015-05-05 |
| 8930160 | Measurement system for the wireless position-independent measurement of the temperature | Bert Wall | 2015-01-06 |