Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6000901 | Apparatus for indexing magazines holding molded leadframes and a method therefor | — | 1999-12-14 |
| 5830403 | Method of post mold curing plastic encapsulated semiconductor chips mounted on lead frames by operating a post mold curing apparatus in association with a molding line system | — | 1998-11-03 |
| 5690885 | Method for forming encapsulated semicondcutor chips | — | 1997-11-25 |
| 5647472 | Automatic pellet feeding apparatus for use in forming encapsulated semiconductor chips and method therefor | — | 1997-07-15 |
| 5622731 | Automatic post mold curing apparatus for use in providing encapsulated semiconductor chips and method therefor | — | 1997-04-22 |
| 5578871 | Integrated circuit package and method of making the same | — | 1996-11-26 |
| 5531014 | Electromechanical press and method of operating | — | 1996-07-02 |
| 5493768 | Electromechanical press and method of operating | — | 1996-02-27 |
| 5478226 | Automatic plunger apparatus for use in forming encapsulated semiconductor chips | — | 1995-12-26 |
| 5443101 | Modular electromechanical press and method therefor | — | 1995-08-22 |
| 5396933 | Package for a semiconductor device including a lead shaping assembly | — | 1995-03-14 |
| 5355018 | Stress-free semiconductor leadframe | — | 1994-10-11 |
| 5326243 | Compression-cavity mold for plastic encapsulation of thin-package integrated circuit device | — | 1994-07-05 |
| 5306401 | Method for drilling cooling holes in turbine blades | Martien H. H. van Dijk, Ger J. N. E. de Vlieger | 1994-04-26 |
| 5291814 | Lead frame cutting apparatus for integrated circuit packages | — | 1994-03-08 |
| 5275546 | Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor | — | 1994-01-04 |
| 5226226 | Tube-shaped package for a semiconductor device and method therefor | — | 1993-07-13 |
| 5155901 | Integrated circuit lead frame positioner apparatus and method | — | 1992-10-20 |
| 5155902 | Method of packaging a semiconductor device | — | 1992-10-20 |
| 5146662 | Lead frame cutting apparatus for various sized integrated circuit packages and method therefor | — | 1992-09-15 |