Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9324643 | Integrated circuit device having exposed contact pads and leads supporting the integrated circuit die and method of forming the device | Ela Mia Cadag | 2016-04-26 |
| 9012268 | Leadless packages and method of manufacturing same | Jonathan Jaurigue, Rogelio Real, Francis Ann Llana, Rodolfo Gacusan | 2015-04-21 |
| 7166496 | Method of making a packaged semiconductor device | Osvaldo Jorge Lopez, Mark Henry S. Antiporta, Fernando Villon Capinig, Emmievel S. Anacleto, Mizpa B. Mijares | 2007-01-23 |