Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334274 | Trench capacitors | Appo VAN DER WIEL, Piet De Pauw | 2025-06-17 |
| 11916104 | Trench insulation structure with enlarged electrically conductive side wall | — | 2024-02-27 |
| 11829074 | Geometrically shaped components in an assembly for a transfer print and associated methods | — | 2023-11-28 |
| 11600603 | Semiconductor device along with multi-functional units and method for manufacturing a semiconductor device | Nis Hauke Hansen | 2023-03-07 |
| 11437266 | Method of manufacturing semiconductor devices to increase yield in micro-transfer printing | — | 2022-09-06 |
| 11355582 | Trench insulation structure with enlarged electrically conductive side wall | — | 2022-06-07 |
| 11037812 | Method for a transfer print between substrates | Oliver Haluch | 2021-06-15 |
| 10930497 | Semiconductor substrate and method for producing a semiconductor substrate | — | 2021-02-23 |
| 10845710 | Geometrically shaped components in an assembly for a transfer print and associated methods | — | 2020-11-24 |
| 10186502 | Integrated circuit having a component provided by transfer print and method for making the integrated circuit | — | 2019-01-22 |
| 9070768 | DMOS transistor having an increased breakdown voltage and method for production | Phil Hower, Gabriel Kittler, Klaus Schottmann | 2015-06-30 |
| 8921945 | High-voltage power transistor using SOI technology | — | 2014-12-30 |
| 8823095 | MOS-power transistors with edge termination with small area requirement | — | 2014-09-02 |
| 8793116 | Method for the construction of vertical power transistors with differing powers by combination of pre-defined part pieces | Wolfgang Miesch | 2014-07-29 |
| 8759169 | Method for producing silicon semiconductor wafers comprising a layer for integrating III-V semiconductor components | Gabriel Kittler | 2014-06-24 |
| 8546207 | Method for fabricating semiconductor wafers for the integration of silicon components with HEMTs, and appropriate semiconductor layer arrangement | Gabriel Kittler | 2013-10-01 |
| 8530999 | Semiconductor component with isolation trench intersections | Uwe Eckoldt | 2013-09-10 |
| 8448101 | Layout method for vertical power transistors having a variable channel width | Wolfgang Miesch | 2013-05-21 |
| 8278183 | Production of isolation trenches with different sidewall dopings | — | 2012-10-02 |
| 8247884 | Semiconductor structure for fabricating a handle wafer contact in a trench insulated SOI disc | — | 2012-08-21 |
| 8190415 | Method for the construction of vertical power transistors with differing powers by combination of pre-defined part pieces | Wolfgang Miesch | 2012-05-29 |
| 8053897 | Production of a carrier wafer contact in trench insulated integrated SOI circuits having high-voltage components | — | 2011-11-08 |
| 7989308 | Creation of dielectrically insulating soi-technlogical trenches comprising rounded edges for allowing higher voltages | Uwe Eckoldt, Thomas Oetzel | 2011-08-02 |
| 7989921 | Soi vertical bipolar power component | — | 2011-08-02 |
| 7625805 | Passivation of deep isolating separating trenches with sunk covering layers | Uwe Eckoldt | 2009-12-01 |