Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12127160 | Communication method and apparatus | Xiangdong Zhang, Junren Chang | 2024-10-22 |
| 11765787 | Entity configuration method, device and system, and CU-U | Yin Gao, He Huang | 2023-09-19 |
| 11606720 | Flow control method and apparatus, CU, DU and storage medium | Yin Gao, He Huang | 2023-03-14 |
| 11206106 | Data packet synchronization | Yin Gao, He Huang | 2021-12-21 |
| 11153783 | Flow control method and apparatus, CU, DU and storage medium | Yin Gao, He Huang | 2021-10-19 |
| 11019680 | Entity configuration method, device and system, and CU-U | Yin Gao, He Huang | 2021-05-25 |
| 10980043 | Data transmission method and device, and base station | He Huang | 2021-04-13 |
| 10560226 | Data packet synchronization | Yin Gao, He Huang | 2020-02-11 |
| 9570325 | Packaged semiconductor devices having ribbon wires | Liqiang Xu, Peng Liu, Hanmin Zhang | 2017-02-14 |
| 9355944 | Semiconductor device and lead frame having vertical connection bars | Peng Liu, Ping Wu | 2016-05-31 |
| 9328425 | Device and process for continuously cleaning surface of molybdenum wire at high temperature | Qi Zhou, Jian Li | 2016-05-03 |
| 9177836 | Packaged integrated circuit device having bent leads | Peng Liu, Ping Wu | 2015-11-03 |
| 8969135 | Semiconductor device and method of assembling same | Peng Liu, Zhaobin Qi, Liqiang Xu, Tong Zhao | 2015-03-03 |
| 8692134 | Brace for long wire bond | Jie Yang, Hanmin Zhang | 2014-04-08 |
| 8643158 | Semiconductor package and lead frame therefor | Peng Liu, Ping Wu | 2014-02-04 |
| 8642395 | Method of making chip-on-lead package | Zhe Li, Guanhua Wang, Zhijie Wang, Nan Xu | 2014-02-04 |
| 8486540 | Lead frame sheet | Ting Li, Yongqiang Liu | 2013-07-16 |
| 8080448 | Semiconductor device with nested rows of contacts | Ping Wu, Peng Liu | 2011-12-20 |