Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6415975 | Determination of quality of bonding between a conductive ball and a conductive pad within an IC package | Watana Sabyeying | 2002-07-09 |
| 6193134 | Determination of quality of bonding between a conductive ball and a conductive pad within an IC package | Watana Sabyeying | 2001-02-27 |