Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1063146 | Computer assembly housing | Christopher B. Lirakis, Mark E. Podlaseck, Jerry M. Chow, Amir Niknammoghadam | 2025-02-18 |
| 12013170 | Device and method for providing a thermally conductive coupling | Anssi Salmela, Rob Blaauwgeers | 2024-06-18 |