Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11987701 | Thermosetting resin compositions, liquid packaging material, film, semiconductor package, interlayer insulating film, and flame-retardant resin composition | — | 2024-05-21 |
| 11945913 | Thermosetting polyimide resin and manufacturing method thereof, composition, prepolymer, film, adhesive, and use thereof | — | 2024-04-02 |
| 11732134 | Benzocyclobutene-containing polyimide resin and its composition, manufacturing method, redistribution layer, polyimide film, and use | — | 2023-08-22 |