| 9006878 |
Method and device for wafer scale packaging of optical devices using a scribe and break process |
Xiao Yang, Dongmin Chen |
2015-04-14 |
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Low temperature hermetic bonding at water level and method of bonding for micro display application |
— |
2010-11-16 |
| 7825519 |
Method and device for wafer scale packaging of optical devices using a scribe and break process |
Xiao Yang, Dongmin Chen |
2010-11-02 |
| 7585747 |
Low temperature hermetic bonding at water level and method of bonding for micro display application |
— |
2009-09-08 |
| 7344956 |
Method and device for wafer scale packaging of optical devices using a scribe and break process |
Xiao Yang, Dongmin Chen |
2008-03-18 |
| 6426880 |
Surface mounted device with grooves on a termination lead |
— |
2002-07-30 |
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Method and apparatus for stacking IC devices |
— |
2002-06-18 |
| 6251219 |
Method and apparatus for use in assembling electronic devices |
Dennis M. Gibson, Cuong Pham |
2001-06-26 |
| 6246587 |
Surface mounted device with grooves on a termination lead and methods of assembly |
— |
2001-06-12 |
| 6182357 |
Method and apparatus for dicing electronic substrate |
John C. Munson, Timothy M. Gadd |
2001-02-06 |
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Semiconductor device packaging and method of fabrication |
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1999-11-16 |
| 5963429 |
Printed circuit substrate with cavities for encapsulating integrated circuits |
— |
1999-10-05 |