Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163762 | Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting | Hui Ding, Tao Yu, Jun Liu, Jun-Kai Bai, Chih-Ping Peng | 2018-12-25 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163762 | Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting | Hui Ding, Tao Yu, Jun Liu, Jun-Kai Bai, Chih-Ping Peng | 2018-12-25 |