Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4360142 | Method of forming a solder interconnection capable of sustained high power levels between a semiconductor device and a supporting substrate | Charles L. Carpenter, Joseph F. Fugardi, Lawrence V. Gregor, Morton D. Reeber | 1982-11-23 |
| 4290079 | Improved solder interconnection between a semiconductor device and a supporting substrate | Charles L. Carpenter, Joseph F. Fugardi, Lawrence V. Gregor, Morton D. Reeber | 1981-09-15 |