Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6518665 | Enhanced underfill adhesion | George R. Westby, Wilhelm Prinz von Hessen | 2003-02-11 |
| 5563449 | Interconnect structures using group VIII metals | John Dion, Che-Yu Li | 1996-10-08 |
| 5439731 | Interconnect structures containing blocked segments to minimize stress migration and electromigration damage | Che-Yu Li, Matt A. Korhonen | 1995-08-08 |