Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6908843 | Method and system of wire bonding using interposer pads | Herald M. Baldonado, Celine R. Mandapat | 2005-06-21 |
| 6552430 | Ball grid array substrate with improved traces formed from copper based metal | Ma Mandapat, Ferdinand Arabe, Alvin O. Soria | 2003-04-22 |