Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7153757 | Method for direct bonding two silicon wafers for minimising interfacial oxide and stresses at the bond interface, and an SOI structure | William Nevin | 2006-12-26 |
| 6955988 | Method of forming a cavity and SOI in a semiconductor substrate | William Nevin | 2005-10-18 |