Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230928 | Spot plated leadframe and IC bond pad via array design for copper wire | Robert W. Warren | 2016-01-05 |
| 9142491 | Semiconductor package with corner pins | Robert W. Warren, Hyun Jane Lee | 2015-09-22 |
| 9029991 | Semiconductor packages with reduced solder voiding | Robert W. Warren, Hyun-Jung Lee | 2015-05-12 |
| 8552540 | Wafer level package with thermal pad for higher power dissipation | Robert W. Warren | 2013-10-08 |
| 8540529 | Shielded USB connector module with molded hood and LED light pipe | Robert W. Warren | 2013-09-24 |
| 8455990 | Systems and methods of tamper proof packaging of a semiconductor device | Robert W. Warren, Hyun-Jung Lee | 2013-06-04 |