MR

Morton D. Reeber

IBM: 3 patents #26,272 of 70,183Top 40%
📍 Shrub Oak, NY: #14 of 28 inventorsTop 50%
🗺 New York: #38,318 of 115,490 inventorsTop 35%
Overall (All Time): #1,684,062 of 4,157,543Top 45%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
4360142 Method of forming a solder interconnection capable of sustained high power levels between a semiconductor device and a supporting substrate Charles L. Carpenter, Joseph F. Fugardi, Lawrence V. Gregor, Peter S. Grosewald 1982-11-23
4312012 Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant Rudolf G. Frieser 1982-01-19
4290079 Improved solder interconnection between a semiconductor device and a supporting substrate Charles L. Carpenter, Joseph F. Fugardi, Lawrence V. Gregor, Peter S. Grosewald 1981-09-15