Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5609773 | Method for manufacture of multilayer wiring board and the multilayer wiring board | Tetsuya Watanabe | 1997-03-11 |
| 5507403 | Process for producing an electronic part and the electronic part produced by the process | Yukio Sakemura, Tetsuya Watanabe | 1996-04-16 |
| 4686606 | Device for cooling integrated circuit chip | Minoru Yamada, Akira Masaki, Keiichirou Nakanishi, Masahide Tokuda | 1987-08-11 |