MM

Michiaki Murata

FI Fujifilm Business Innovation: 42 patents #280 of 1,659Top 20%
FU Fujifilm: 1 patents #3,076 of 4,519Top 70%
Overall (All Time): #69,259 of 4,157,543Top 2%
43
Patents All Time

Issued Patents All Time

Showing 1–25 of 43 patents

Patent #TitleCo-InventorsDate
12261414 Light-emission device, optical device, and information processing device Takeshi MINAMIRU, Kenichi Ono, Satoshi Inada 2025-03-25
12027510 Light-emitting element array chip, light-emitting device, optical device, and information processing device Takashi Kondo, Satoshi Inada, Takeshi MINAMIRU, Daisuke Iguchi, Kazuhiro Sakai +1 more 2024-07-02
11953308 Light emitting element array and optical measuring system Shigetoshi Nakamura, Kenichi Ohno, Tsutomu Ishii, Jiro Minabe 2024-04-09
11657130 Light emitter, light emitting device, optical device, and information processing apparatus Satoshi Inada, Kenichi Ono, Takeshi MINAMIRU, Takafumi Higuchi 2023-05-23
11081344 Method for manufacturing semiconductor substrate Atsushi Fukugawa 2021-08-03
10477732 Light irradiation device, light irradiation system, and image forming apparatus Akira Sakamoto, Atsuyuki Kitamura, Hiroyuki Tsukuni, Akira Mihara, Naoya Kamigaito +2 more 2019-11-12
9997363 Method for producing semiconductor piece, circuit board and electronic device including semiconductor piece, and method for designing etching condition Kenichi Ono, Hideyuki Ikoma, Shogo Komagata, Tsutomu Otsuka 2018-06-12
9865468 Method of positioning cutting member to semiconductor chip with grooves Kenichi Ono, Tsutomu Otsuka 2018-01-09
9802402 Method of manufacturing heating device by screen printing Kazuhiro Hayashi, Koichi Haga, Shuichi Yamada, Mutsuya Takahashi 2017-10-31
9754833 Method for manufacturing semiconductor chip that includes dividing substrate by etching groove along cutting region of substrate combined with forming modified region by laser irradiating along cutting region in substrate Takahiro Hashimoto, Kenichi Ono, Hideyuki Ikoma, Tsutomu Otsuka 2017-09-05
9735056 Semiconductor piece manufacturing method and substrate dicing method for suppressing breakage Mutsuya Takahashi, Shuichi Yamada 2017-08-15
9673351 Method of manufacturing semiconductor chips Takeshi MINAMIRU, Kenji Yamazaki, Tsutomu Otsuka 2017-06-06
9673080 Semiconductor piece manufacturing method Mutsuya Takahashi, Shuichi Yamada 2017-06-06
9589812 Fabrication method of semiconductor piece Mutsuya Takahashi, Shuichi Yamada 2017-03-07
9508595 Method of tip shape of cutting member, semiconductor chip manufacturing method, circuit board, and electronic apparatus Takeshi MINAMIRU, Hiroaki Tezuka, Kenji Yamazaki, Tsutomu Otsuka, Shuichi Yamada +1 more 2016-11-29
9455173 Semiconductor piece manufacturing method Mutsuya Takahashi, Shuichi Yamada 2016-09-27
9385268 Method of manufacturing semiconductor chips Takeshi MINAMIRU, Kenji Yamazaki, Tsutomu Otsuka 2016-07-05
9368406 Method for manufacturing semiconductor chip Hirokazu Matsuzaki, Kenji Yamazaki, Takahiro Hashimoto, Takeshi MINAMIRU 2016-06-14
8726509 Method of manufacturing an ink jet recording head of laminate structure Kumiko Tanaka 2014-05-20
8692264 Light-emitting element, method of manufacturing light-emitting element, self-scanning light-emitting element array, optical writing head, and image forming apparatus Taku KINOSHITA, Takashi Kondo, Kazutaka TAKEDA, Hideo Nakayama 2014-04-08
8585186 Method of manufacturing substrate and substrate, method of manufacturing liquid drop ejecting head and liquid drop ejecting head, and liquid drop ejecting device Regan Nayve 2013-11-19
8278667 Light-emitting element and light-emitting element fabrication method Shuichi Yamada, Hiroyuki Usami, Takahiro Hashimoto 2012-10-02
8177334 Method of manufacturing substrate and substrate, method of manufacturing liquid drop ejecting head and liquid drop ejecting head, and liquid drop ejecting device Regan Nayve 2012-05-15
8166835 Sensor chip and inspection device 2012-05-01
8141250 Method of manufacturing a droplet discharging head Kumiko Tanaka 2012-03-27