Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327806 | Semiconductor die with peculiar bond pad arrangement for leveraging mutual inductance between bond wires to realize bond wire T-coil circuit with equivalent negative inductance | Huan-Sheng Chen, Chun-Wei Chen | 2025-06-10 |
| 12278206 | Semiconductor package with conductive adhesive that overflows for return path reduction and associated method | Chun-Wei Chen, Yan Luo | 2025-04-15 |