Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5236630 | Conductor paste containing high amounts of either molybdenum or tungsten | Hideo Arima, Takashi Kuroki, Masao Sekihata, Mutsumi Horikoshi | 1993-08-17 |
| 5016089 | Substrate for hybrid IC, hybrid IC using the substrate and its applications | Tadamichi Asai, Toshio Ogawa, Osamu Ito, Akira Ikegami, Mitsuru Hasegawa +2 more | 1991-05-14 |
| 4873022 | Electrically conductive paste, electronic circuit component and method for producing same | Toshio Ogawa, Tadamichi Asai, Akira Ikegami, Hiroshi Ohtsu, Kazuhiko Ato | 1989-10-10 |