Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478513 | Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate | Jen-Yu Chen, Ting Yu Fu, CHIEN-CHEN LEE | 2016-10-25 |
| 8741764 | Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate | Jen-Yu Chen, Ting Yu Fu, CHIEN-CHEN LEE | 2014-06-03 |