Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424492 | Method of fabricating integrated circuit packaging with etched base | Poh Cheng Ang, Linhui Yuan | 2019-09-24 |
| 10190218 | Integrated circuit substrate containing photoimageable dielectric material and method of producing thereof | Linhui Yuan, Poh Cheng Ang | 2019-01-29 |