Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12126440 | Communication devices and methods based on markov-chain monte-carlo (MCMC) sampling | Sundar Krishnamurthy, Lu Lu, Niranjan Mylarappa Gowda, Richard Dorrance, Deepak Dasalukunte +1 more | 2024-10-22 |
| 12065040 | Testing platform and method for evacuated tube high-temperature superconducting magnetic levitatrion (HTS maglev) under high-speed operation state | Weihua Zhang, Zigang Deng, Wenxiang Zhou, Haiquan Bi, Yuanbo Wang +1 more | 2024-08-20 |
| 12058814 | Power module and manufacturing method thereof | Shouyu Hong, Jinping Zhou, Min Zhou, Xiaoni Xin, Pengkai Ji +2 more | 2024-08-06 |
| 12005942 | Vehicle running system and method based on rail transport | Zigang Deng, Kaiwen Li, Jun Zheng, Xin Liu, Yihao Chen | 2024-06-11 |
| 11971326 | Dynamic simulation test platform and method for ultra-high-speed evacuated tube magnetic levitation (maglev) transportation | Weihua Zhang, Zigang Deng, Haiquan Bi, Wenxiang Zhou, Jun GUO +2 more | 2024-04-30 |
| 11801756 | Permanent magnet electrodynamic suspension system and guidance method therefor | Zigang Deng, Hongfu Shi, Yuqing Xiang, Ting Cao, Hao Lu +2 more | 2023-10-31 |
| 11745598 | Magnetic wheel driving device and driving method using same | Zigang Deng, Kaiwen Li, Xin Liu, Hongfu Shi, Jun Zheng | 2023-09-05 |
| 11709533 | Power chip | Xiaoni Xin | 2023-07-25 |
| 11575398 | Antenna controller for antenna with linearized power amplifiers | Mats Alexanderson, Hossein Mashad Nemati, Mark Holm, Binbin Zhang | 2023-02-07 |
| 11533819 | Method for manufacturing a stack structure | Zhenqing Zhao | 2022-12-20 |
| 11435797 | Manufacturing method of power module | Shouyu Hong, Yiqing Ye, Kai Lu, Qingdong Chen, Jianhong Zeng | 2022-09-06 |
| 11316438 | Power supply module and manufacture method for same | Pengkai Ji, Shouyu Hong, Xiaoni Xin, Zhenqing Zhao | 2022-04-26 |
| 11063525 | Power supply module and manufacture method for same | Pengkai Ji, Shouyu Hong, Xiaoni Xin, Zhenqing Zhao | 2021-07-13 |
| 11036269 | Power module and manufacturing method thereof | Shouyu Hong, Yiqing Ye, Kai Lu, Qingdong Chen, Jianhong Zeng | 2021-06-15 |
| 11024588 | Power integrated module | Jianhong Zeng, Yan Chen, Xiaoni Xin | 2021-06-01 |
| 10985645 | Alternatingly-switched parallel circuit, integrated power module and integrated power package | Chaofeng Cai, Yan Chen, Xiaoni Xin | 2021-04-20 |
| 10871811 | Power chip | Yan Chen, Xiaoni Xin, Shouyu Hong, Jianhong Zeng | 2020-12-22 |
| 10826483 | Power chip and bridge circuit | Yan Chen, Xiaoni Xin, Shouyu Hong, Jianhong Zeng | 2020-11-03 |
| 10629550 | Power integrated module | Jianhong Zeng, Yan Chen, Xiaoni Xin | 2020-04-21 |
| 10620654 | Alternatingly-switched parallel circuit, integrated power module and integrated power package | Chaofeng Cai, Yan Chen, Xiaoni Xin | 2020-04-14 |
| 10340617 | Power modules and pin thereof | Shouyu Hong, Zhenqing Zhao | 2019-07-02 |
| 10342153 | Stack structure and the manufacturing method of the same | Zhenqing Zhao | 2019-07-02 |
| 10204882 | Stacked package module having an exposed heat sink surface from the packaging | Shou-Yu Hong, Zhen-Qing ZHAO | 2019-02-12 |
| 10198020 | Interleaved parallel circuit, integrated power module and integrated power chip | Chaofeng Cai, Yan Chen | 2019-02-05 |
| 10126795 | Power chip | Yan Chen, Xiaoni Xin, Shouyu Hong, Jianhong Zeng | 2018-11-13 |