Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343424 | Structure of circuit board with voids | Hui-Ying Chou | 2016-05-17 |
| 9159697 | Method for forming voids of structure | Hui-Ying Chou | 2015-10-13 |
| 8984455 | Methods for generating schematic diagrams and apparatuses using the same | Feng-Ling Lin, Wen-Jui Kuo | 2015-03-17 |
| 7409661 | Computer-aided thermal relief pad design system and method | — | 2008-08-05 |