Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9632109 | Methods, apparatus, and systems for contacting semiconductor dies that are electrically coupled to test access interface positioned in scribe lines of a wafer | Duncan Gurley | 2017-04-25 |
| 6549026 | Apparatus and method for temperature control of IC device during test | Mark F. Malinoski, Tomoya Shitara | 2003-04-15 |