Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11492519 | Polyimide film for semiconductor package | Ju Hwan Chun, Ho-Young Park, Tae-seok Lee | 2022-11-08 |
| 11015089 | Polyimide film for semiconductor package reflow process, and manufacturing method therefor | Ho-Young Park, Tae-seok Lee | 2021-05-25 |