Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9245814 | Substrate assembly, method of manufacturing substrate assembly and method of manufacturing chip package | Takashi Fushie, Hajime Kikuchi | 2016-01-26 |
| 4391763 | Process for the manufacture of halogen-containing resin particles of larger bulk density comprising mixing particles of the resin with inorganic salts, treated in a mixture in a gaseous phase and separating the inorganic salt from the product | Akiyasu Ishii, Masazi Hukuda, Kazuyuki Nakayama | 1983-07-05 |