Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6781225 | Glueless integrated circuit system in a packaging module | Kuo-Ning Chiang, Wen-Hwa Chen | 2004-08-24 |
| 6696738 | Miniaturized image sensor | Hsiu-Wen Tu | 2004-02-24 |
| 6137174 | Hybrid ASIC/memory module package | Kuo-Ning Chiang, Wen-Hwa Chen | 2000-10-24 |
| 6034425 | Flat multiple-chip module micro ball grid array packaging | Kuo-Ning Chiang, Wen-Hwa Chen | 2000-03-07 |
| 6023097 | Stacked multiple-chip module micro ball grid array packaging | Kuo-Ning Chiang, Wen-Hwa Chen | 2000-02-08 |