KO

Kuang Eng Oh

📍 Teluk Tempoyak, MY: #2 of 4 inventorsTop 50%
Overall (All Time): #2,695,118 of 4,157,543Top 65%
1
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11508690 Laser compression bonding device and method for semiconductor chip Jae Shin Park 2022-11-22