Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12370632 | Metal particle for adhesive paste, method of preparing the same, solder paste including the same, composite bonding structure formed therefrom, and semiconductor device including the composite bonding structure | Junghoon Lee | 2025-07-29 |
| 12288765 | Hybrid bonding structures, semiconductor devices having the same, and methods of manufacturing the semiconductor devices | Byonggwon Song, Junghoon Lee | 2025-04-29 |
| 11804462 | Hybrid bonding structures and semiconductor devices including the same | Junghoon Lee, Byonggwon Song | 2023-10-31 |
| 10392518 | Paste material, wiring member formed from the paste material, and electronic device including the wiring member | Byonggwon Song, Sunghoon Park, Kiyeon YANG, Changseung LEE | 2019-08-27 |
| 10249604 | Semiconductor device and method of manufacturing the same | Changyoul Moon, Sunghee Lee, Junsik HWANG | 2019-04-02 |
| 9831211 | Anisotropic conductive material, electronic device including anisotropic conductive material, and method of manufacturing electronic device | Wonsuk Chang, Chanmoon Chung | 2017-11-28 |