Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE38961 | Method for production of semiconductor package | Atsushi Okuno, Noriko Fujita, Yuki Ishikawa, Noritaka Oyama, Tsunekazu Hashimoto | 2006-01-31 |
| 6063646 | Method for production of semiconductor package | Atsushi Okuno, Noriko Fujita, Yuki Ishikawa, Noritaka Oyama, Tsunekazu Hashimoto | 2000-05-16 |
| 5232651 | Method of sealing electric parts mounted on electric wiring board with resin composition | Atsushi Okuno, Tsunekazu Hashimoto, Masajiro Inoue | 1993-08-03 |