KK

Kouichi Kunimune

CH Chisso: 28 patents #23 of 833Top 3%
Overall (All Time): #140,196 of 4,157,543Top 4%
28
Patents All Time

Issued Patents All Time

Showing 1–25 of 28 patents

Patent #TitleCo-InventorsDate
6664021 Photosensitive polymide precursor resin composition Hirotoshi Maeda, Eiji Watanabe, Kouichi Katou 2003-12-16
5589319 Photosensitive polyimide resin composition Kouichi Katou, Eiji Watanabe 1996-12-31
5473040 Polyimidesiloxane film of low heat-conductivity Toshiharu Aono 1995-12-05
5449588 Photosensitive polyimide precursor composition with photoacid generator Hirotoshi Maeda, Eiji Watanabe, Kouichi Katou 1995-09-12
5449705 Silicon-containing polyamic acid derivative and photosensitive resin composition using it Eiji Watanabe, Kouichi Katou, Hirotoshi Maeda 1995-09-12
5442024 Photosensitive polyimide precursor composition Hirotoshi Maeda, Kouichi Katou, Eiji Watanabe 1995-08-15
5342739 Method of preparing a negative pattern utilizing photosensitive polymer composition containing quinonediazide compound and a poly(amido)imide precursor Kouichi Katou, Hirotoshi Maeda 1994-08-30
5326792 Polyimide photosensitive cover coating agent Yoshinori Masaki, Hirotoshi Maeda 1994-07-05
5320935 Method of forming a pattern from a photosensitive heat-resistant poly(amide)imide having hydroxyphenyl groups Hirotoshi Maeda 1994-06-14
5300627 Adhesive polyimide film Yoshihiro Soeda, Setsuo Itami, Kazutsune Kikuta 1994-04-05
5298359 Photosensitive heat-resistant polymer having hydroxyphenyl group for forming a patterned image Hirotoshi Maeda 1994-03-29
5294696 Process for producing polyisoimide Hirotoshi Maeda 1994-03-15
5084557 Diamino compounds and liquid crystal aligning films Shizuo Murata, Naoyoshi Emoto, Kenji Furukawa, Ryuji Kobayashi, Masami Tanaka 1992-01-28
5071908 Silicon polyimide precursor composition Ryuji Kobayashi 1991-12-10
5055549 Process for preparing photosensitive heat-resistant polymer Hirotoshi Maeda 1991-10-08
5026788 Photosensitive polymer having thiol group Hirotoshi Maeda 1991-06-25
5025088 Photosensitive poly(amide)imide heat-resistant polymer Hirotoshi Maeda 1991-06-18
4970283 Silicon-containing soluble polyimide precursor, its cured material, and method for preparing them Haruo Kato, Yoshiya Kutsuzawa 1990-11-13
4963635 Processes for the production of silicon-containing polyimides precursors, and their cured polyimides low in hygroscopicity Yoshiya Kutsuzawa 1990-10-16
4959437 Process for producing a low thermally expansive and highly adhesive silicon-containing polyimide and a precursor thereof Yoshiya Kutsuzawa, Shiro Konotsune 1990-09-25
4923968 Melt-moldable crystalline polyimide polymer Kazutsune Kikuta, Takao Kawamoto, Shiro Konotsune 1990-05-08
4904758 Low-melting polyimide copolymer and method for preparing the same Hirotoshi Maeda 1990-02-27
4864008 Diamond compounds and liquid crystal aligning films Shizuo Murata, Naoyoshi Emoto, Kenji Furukawa, Ryuji Kobayashi, Masami Tanaka 1989-09-05
4818806 Process for producing highly adherent silicon-containing polyamic acid and corsslinked silicon-containing polyimide Yoshiya Kutsuzawa, Hiromi Egawa, Shiro Konotsune 1989-04-04
4672099 Soluble polyimide-siloxane precursor, process for producing same and cross-linked polyimide-siloxane Yoshiya Kutsuzawa, Shiro Konotsune 1987-06-09