Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10308758 | Filling material for three-dimensional mounting of semiconductor element | Hiroki Tanaka | 2019-06-04 |
| 10118322 | Sheet-shaped mold, production method therefor, and application therefor | Tomoya Mizuta, Takuya OSAKA, Arimichi Okumura, Hiroto Miyake, Masaya Omura +1 more | 2018-11-06 |
| 10047257 | Adhesive agent composition for multilayer semiconductor | Hiroki Tanaka, Kiyoharu Tsutsumi, Yousuke Ito, Naoko Tsuji | 2018-08-14 |